Thermal conductive paste GD600, 1g | AMPUL.eu
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Thermal conductive paste GD600, 1g

1.01 €

1.01 € Tax excluded

(1,010.73 €/kg)

1.01 € without VAT
new_releases In stock at supplier

The lowest price in the last 45 days was 1.22 €

datasheet

High quality heat conductive paste for heat sinks with thermal conductivity up to 3.2W/mK. The thermal paste is designed to ensure better heat transfer between the heat source - electronic component and its heat sink. It fills the unevenness between the surface of the heat sink and the surface of the cooled component and thus increases the heat transfer to the heat sink, which then has greater cooling efficiency. By using a heat conductive paste, you will improve the overall cooling efficiency and extend the life of the cooled components. Suitable for all semiconductors (LEDs), processors, graphics cards, memory modules and more. The paste is not electrically conductive.

Thermal conductivity: 3.2W/mK

Minimum operating temperature: -50°C

Maximum operating temperature: 200°C

Specific gravity:

AM3012
Color
Silver
Max. operating temperature
200°C
Thermal conductivity
3.2W/mK
Amount
1g